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Description
HIGH DEPOSITING SPEED / HIGH CURRENT REVERSE PULSE PLATING TECHNOLOGY
To meet increasing demand from the FOPLP and Interposer markets, Schloetter has recently developed SLOTOCOUP ME 2150: and electroplated copper electrolyte product. This product has excellent via-filling capabilities and copper coverage inside holes, making it particularly suitable for TGV (Through Glass Via) products, ensure a more efficient process and superior electrical performance.
Application:
- FOPLP (Fan out panel level package)
- IC interposer
- Hyper speed server and communication sever
- IC
- Redistribution layer (RDL)
To meet increasing demand from the FOPLP and Interposer markets, Schloetter has recently developed SLOTOCOUP ME 2150: and electroplated copper electrolyte product. This product has excellent via-filling capabilities and copper coverage inside holes, making it particularly suitable for TGV (Through Glass Via) products, ensure a more efficient process and superior electrical performance.
Application:
- FOPLP (Fan out panel level package)
- IC interposer
- Hyper speed server and communication sever
- IC
- Redistribution layer (RDL)
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