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Description
ENEPIG is formed by the deposition of electroless nickel, followed by electroless palladium, with an immersion gold flash. It is suitable for soldering, gold wire bonding, aluminum wire bonding, and contact resistance.
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Process ENIG - Electroless Nickel Immersion Gold
Process IGEPIG - Immersion Gold / Electroless Palladium / Immersion Gold
GT-01
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Basic chemicals
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