ENEPIG is formed by the deposition of electroless nickel, followed by electroless palladium, with an immersion gold flash. It is suitable for soldering, gold wire bonding, aluminum wire bonding, and contact resistance.
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Machine for plating (VCP Line) / PM Man Application
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Copper Ball 25, 28, 55 mm. / Tin ball 22, 25 mm. / Copper Slug