Login
Contact

VCP copper plating equipment

Model: K type 510

Category: Electroplating

Exhibitor: DONGWEI TECHNOLOGY (THAILAND) CO., LTD.

Booth No: B328

1
Share :
Share :

Description
Panel plating& pattern plating, FPC via filling
Speed is 0.3~2m/min, adjustable;
Board size: fixed height 250mm, and length is 180-510mm;
Board thickness: 0.036~1.6mm;
density: max=5ASD
Uniformity: panel thickness R value ≦2.0μm(panel plating thickness is 10μm);
TP Value: 120-150%
You may also like
Electrolytic Stripping of Silver, Tin, and Electronic Waste.
Electrolytic Gold Recovery
Electrolytic Silver Recovery
Basic chemicals
Alkaline etching liquid extraction, acidic etching liquid copper recovery.
Filming Water Electrolytic Recovery Machine

Highest Rated Products

Six Dots Humidity Indicator Card Blue to Pink
KARDEX COMPACT BUFFER
BEATRUM
RT-1000 Rotary Tubing Dispenser
防焊塞孔万用导气板
Compact Ejectors : SCPLb / SCPLc
Electric Vacuum Generator : ECBPMi
ATD300CV-S
AXELIA
防焊塞孔万用导气板
Moisture Proof Packaging Bag for Electronic Products
AUTOTUBE
EP02 Powered Grease Lubricator
Glad Fixed Achieve Valve
KARDEX HORIZONTAL CAROUSEL
Pneumatic operated grease pump
Electrical Compact Pump : GCPi
Vacuum Area Gripping Systems : FQE
Multi-Point Compensating X-Ray 2-Spindle Drilling Machine
Compact Valves : LQEc / LQEi
Edit Moisture Humility Indicator Color Change Blue Pink Card
Moisture Proof Customized Bag for Packing Video Card
Pneumatic operated grease pump
KARDEX MEGAMAT
MACHINERY : KARDEX SHUTTLE
MD-2000N Micro Control Dispenser
HP150 Pneumatic Valve
PE rectifier
Vonesco control system
Multiple circle measuring machine
Back