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Exhibitor Product
陶瓷基板激光精密切割设备
Model:
DirectLaser MC5
Category:
11700
Exhibitor:
DCT CO., LTD.
Booth No:
B238
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Description
DirectLaser MC5激光钻孔精度高,可加工LED陶瓷基板、大功率半导体陶瓷基板、薄膜电路、金属基板等多样化材料,尺寸及形状一致性好。环境友好,工艺灵活,容易集成为全自动化连续生产模式。因此将成为未来的主要精、微加工工艺手段
全自动激光打孔系统,适用于陶瓷材料打孔、切割、划片。M5激光切割、打孔精度高,无侧蚀造成的精度问题,尺寸及形状一致性好。而且环境友好,工艺灵活,容易集成为全自动化连续生产模式。针对陶瓷材料打孔、切割工艺简单、可靠,因此将成为未来的主要精、微加工工艺手段,可以成为绝佳的工艺路线
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DCT CO., LTD. - 陶瓷基板激光精密切割设备
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