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Description
DirectLaser MC5激光钻孔精度高，可加工LED陶瓷基板、大功率半导体陶瓷基板、薄膜电路、金属基板等多样化材料，尺寸及形状一致性好。环境友好，工艺灵活，容易集成为全自动化连续生产模式。因此将成为未来的主要精、微加工工艺手段
全自动激光打孔系统，适用于陶瓷材料打孔、切割、划片。M5激光切割、打孔精度高，无侧蚀造成的精度问题，尺寸及形状一致性好。而且环境友好，工艺灵活，容易集成为全自动化连续生产模式。针对陶瓷材料打孔、切割工艺简单、可靠，因此将成为未来的主要精、微加工工艺手段，可以成为绝佳的工艺路线
全自动激光打孔系统，适用于陶瓷材料打孔、切割、划片。M5激光切割、打孔精度高，无侧蚀造成的精度问题，尺寸及形状一致性好。而且环境友好，工艺灵活，容易集成为全自动化连续生产模式。针对陶瓷材料打孔、切割工艺简单、可靠，因此将成为未来的主要精、微加工工艺手段，可以成为绝佳的工艺路线
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