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Description
Properties
Cupric Oxide (High-purity electroplating Grade) is a black powder, with a relative density of 6.3-6.5, it is insoluble in water, soluble in acid and ammonium chloride solution.
Application
Advanced process ensures our Cupric Oxide with below advantages: high content, fast dissolution rate, low impurities contents and good stability. It is mainly used for HDI hole plugging copper plating in the PCB industry.
Parameter
Parameter Index
Cupric Oxide purity ? 99.0 %
Fe ? 10 ppm
Ni ? 10 ppm
Zn ? 10 ppm
Pb ? 5 ppm
Cl ? 15 ppm
Na + Ca + Mg ? 30 ppm
Dissolution Rate ? 15s
HCL insoluble matters ? 30 ppm
Cupric Oxide (High-purity electroplating Grade) is a black powder, with a relative density of 6.3-6.5, it is insoluble in water, soluble in acid and ammonium chloride solution.
Application
Advanced process ensures our Cupric Oxide with below advantages: high content, fast dissolution rate, low impurities contents and good stability. It is mainly used for HDI hole plugging copper plating in the PCB industry.
Parameter
Parameter Index
Cupric Oxide purity ? 99.0 %
Fe ? 10 ppm
Ni ? 10 ppm
Zn ? 10 ppm
Pb ? 5 ppm
Cl ? 15 ppm
Na + Ca + Mg ? 30 ppm
Dissolution Rate ? 15s
HCL insoluble matters ? 30 ppm
Related Products
Basic Copper Carbonate
Cupric Oxide
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