Properties Cupric Oxide (High-purity electroplating Grade) is a black powder, with a relative density of 6.3-6.5, it is insoluble in water, soluble in acid and ammonium chloride solution.
Application Advanced process ensures our Cupric Oxide with below advantages: high content, fast dissolution rate, low impurities contents and good stability. It is mainly used for HDI hole plugging copper plating in the PCB industry.
Parameter Parameter Index Cupric Oxide purity ? 99.0 % Fe ? 10 ppm Ni ? 10 ppm Zn ? 10 ppm Pb ? 5 ppm Cl ? 15 ppm Na + Ca + Mg ? 30 ppm Dissolution Rate ? 15s HCL insoluble matters ? 30 ppm
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Cupric Oxide
Basic Copper Carbonate
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