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Cupric Oxide/CuO

產品型號: 电子电镀级 High-purity electroplating Grade

產品分類: Raw Materials and Chemicals

廠商: TAIXING SMELTING PLANT CO., LTD.

攤位號碼: B441

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產品特色
Properties
Cupric Oxide (High-purity electroplating Grade) is a black powder, with a relative density of 6.3-6.5, it is insoluble in water, soluble in acid and ammonium chloride solution.

Application
Advanced process ensures our Cupric Oxide with below advantages: high content, fast dissolution rate, low impurities contents and good stability. It is mainly used for HDI hole plugging copper plating in the PCB industry.

Parameter
Parameter Index
Cupric Oxide purity ? 99.0 %
Fe ? 10 ppm
Ni ? 10 ppm
Zn ? 10 ppm
Pb ? 5 ppm
Cl ? 15 ppm
Na + Ca + Mg ? 30 ppm
Dissolution Rate ? 15s
HCL insoluble matters ? 30 ppm

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Cupric Oxide
Basic Copper Carbonate
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