1. Good selectivity. The gold surface is not easy to be OSP films, oxidized or discolored; 2. Excellent solderability, especially suitable for wave soldering of DIMM holes. 3. OSP films has excellent heat resistance and can withstand 5x lead-free relfow.
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Browning Solution
SF-Bond (Weak etchant)
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PTH
ENIPIG
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Chemical Reagents
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