1. Wide production operating window, enabling stable nickel plating with P content ranging from 8-11% 2. Low solution attack on solder mask 3. Ni bath: 3.5-4MTO for selective (4.5MTO for general); Au bath: 20 MTO for selective, (30MTO for general); less waste discharge 4. Dense and uniform nickel layer with minimal corrosion 5. Excellent resistance to skip plating or bleeding plating , capable of 35μm pitch
相關產品
OSP
Browning Solution
SF-Bond (Weak etchant)
Pulse Electroplating
Via Filling Electroplating
PTH
ENIPIG
Specialty Chemicals
Chemical Reagents
您可能感興趣的參展商
Supper micro-etch AXE-662
Soda Ash Light
Sodium Persulfate
Stripping solution AXE-827
Copper Clad Laminate
Environmentally friendly stripping agent AXE-098
Antioxidant AXE-309
Sodium Sulphide Flakes
Potassium Persulfate
Acid copper electrolyte
Sodium Carbonate
20-50%H2SO4
Ammonium Persulfate
Cupric Oxide/CuO
Potassium carbonate developer AXE-736
Sodium Persulfate
27.5-50%H2O2
MSA Tin Electro Plating
Electronic cleaner
Potassium Persulfate
Potassium Carbonate
Caustic Soda Flakes
Acid copper electrolyte
Acid copper electrolyte
Cleanroom Mops
人氣產品專區
Six Dots Humidity Indicator Card Blue to Pink
KARDEX COMPACT BUFFER
BEATRUM
RT-1000 Rotary Tubing Dispenser
防焊塞孔万用导气板
Compact Ejectors : SCPLb / SCPLc
Electric Vacuum Generator : ECBPMi
ATD300CV-S
AXELIA
防焊塞孔万用导气板
Moisture Proof Packaging Bag for Electronic Products