1.Thin surface: φ100 μm BVH surface thickness <10 μm 2.Quickly via-filling: φ100 μm/D80 μm filling in 50 min 3.No cutting in filling hole:φ0.5 mm/D1.6mm, knee TP:85% 4.No burrs at board corners after high current plating, excellent chemical scratch resistance
相關產品
OSP
Browning Solution
SF-Bond (Weak etchant)
ENIG
Pulse Electroplating
PTH
ENIPIG
Specialty Chemicals
Chemical Reagents
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