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亞洲工業4.0暨智慧製造系列展
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Via Filling Electroplating

產品型號:

產品分類: Raw Materials and Chemicals

廠商: GUANGDONG TONESET SCI-TECH CO., LTD

攤位號碼: B420

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產品特色
1.Thin surface: φ100 μm BVH surface thickness ＜10 μm
2.Quickly via-filling: φ100 μm/D80 μm filling in 50 min
3.No cutting in filling hole：φ0.5 mm/D1.6mm, knee TP:85%
4.No burrs at board corners after high current plating, excellent chemical scratch resistance
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