Direct Imaging System - Ledia Twin

The Ledia Twin, a general-purpose model, delivers efficient productivity defined in terms of net exposure time thanks to its ability to perform board replacement and alignment operation in parallel on one stage while another board is being exposure on its other stage.
It uses the same high-power, three-wavelength LED light source as other models in the Ledia series, and it delivers up to 50% higher productivity than conventional, single-stage models. The Ledia Twin offers a broad range of capability for solder mask and circuit pattern formation on multilayer boards, flexible boards, and HDIs.

Resolution: L/S = 30/30um
Min. SRO size: Dia. 60um
Imaging positional precision: 10um

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