ENEPIG / IGEPIG Process

Process ENEPIG - Electroless Nickel / Electroless Palladium / Immersion Gold: 

ENEPIG is formed by the deposition of electroless nickel, followed by electroless palladium, with an immersion gold flash. It is suitable for soldering, gold wire bonding, aluminum wire bonding, and contact resistance. 

Features

- Either Pd-P bath or pure Pd bath can be selected.

- The deposition rates of both baths are stable, and thus it is possible to control Pd Thickness from 0.05 to 0.2 μm and more.

- Durability for leaching component from substrates then it is resistible in etching and soldering and it is easy to handle.

- In combination with our mixed replacement redyction type of Au soltion (TWX, TSB, TNK series), it is possiblle to from and ENEPIG layer provides good performance.

Process IGEPIG - Immersion Gold / Electroless Palladium / Immersion Gold: 

IGEPIG is a palladium activator-free process involving 4 key steps: pretreatment, 1st EL-Au layer, 2nd EL-Pd layer and 3rd EL-Au layer.