CSUN and G2C Alliance Build a Trusted Market Brand

Developing technical equipment solutions for PCB industry, showcasing CSP ultra-thin board solutions and current cutting-edge technology.

The G2C Alliance has entered its fifth year and has become a trusted brand in the market. CSUN Industry (2467), utilizing the flying geese theory, has linked alliance enterprises including UTRON, TCF, GPM (5443), GMM (6640), to develop corresponding technical equipment solutions for the PCB industry, dominating various process domains.

CSUN's subsidiary TCF, a wet process equipment manufacturer, showcased AI-intelligent production and data management this year. Star products include super high aspect ratio (AR>25:1) horizontal desmear, chemical copper equipment, ultra-thin board (36μm) horizontal production equipment, thin copper line, brown oxide line, etching line, and non-contact vertical production equipment (desmear, chemical copper horizontal chemical tin equipment), applied in 5G servers, HDI boards, optoelectronic boards, automotive boards, and carrier production.

UTRON exhibited the U860 machine with LCR measurement capabilities, achieving comprehensive positioning accuracy of 2um, completing the initial goal of entering two major carrier board manufacturers' supply chains. NIDEC-READ is the market leader in PCB electrical testing machines. UTRON has persisted in this field for many years, expanding from mid-low end boards to the carrier market. PCBs used in AI servers and low-orbit satellites are thick and large, unlike thin 3C boards, commonly known as thick-large boards, presenting technical challenges and are targeted markets.

Global mobile phone sales have been sluggish in recent years; global market sales volume decreased by 100 million units annually, with each phone using about 10 circuit boards, resulting in a reduction of 1 billion boards per year, significantly impacting board manufacturers and equipment sales; increased second-hand equipment also affects new machine purchases. UTRON states that this year's overall market is weak, with AI server and low-orbit satellite boards unable to drive equipment sector growth.

GPM specializes in automation, focusing on semiconductor packaging in recent years, with its "inspection-grinding-polishing" core technology also applied to carrier boards. Unlike traditional PCB equipment for planarization and thinning, GPM extends from high-end semiconductors, cooperating with customers to optimize performance, improve precision and stability, capable of handling multi-layer, fine-line high-end board production. GPM's transformation has been successful, with semiconductor revenue accounting for nearly 50%, using automation experience to build smart factories for PCB manufacturers.

GMM's revenue comes 100% from semiconductors, specializing in Pick&Place machines. Although not directly related to PCB, their experience in high-precision processing combined with algorithms is shared complementarily through the G2C Alliance, helping achieve breakthrough progress in PCB research and development.