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Exhibitor Profile
GUANGDONG TONESET SCI-TECH CO., LTD
棕化液、高频高速键合剂（低微蚀剂）、超薄面铜填孔电镀液、大电精密度高速填孔电镀液、MSAP图形填空电镀液、脉冲电镀液、水平沉铜等多系列电镀铜；优异耐镍腐蚀、化学沉厚金、镍钯金、抗弯折软镍等多体系化学沉镍 (钯) 金
• Area: PCB
• Booth No:
B420
• Website: http://ghtech.com
Exhibit Products
Pulse Dissolving Copper Electroplating ??溶???
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