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Exhibitor Profile
DCT CO., LTD.
直接激光电路（DLC）/Direct Laser Circuit、直接激光可焊（DLS）/Direct Laser Solderability技术、激光在无掺杂塑料表面上制造导电图案（LPUM）/Laser Patterning Undoped Materials技术，在电子、微电子和集成电路行业具有广阔的产业化前景。不再使用模具，不再需要中间材料，更无须中间过程，德中的原创技术、自主软件、专用设备，直接用机械、激光等技术手段，完成电子元件及电路板加工，替代化学腐蚀、制版印刷、模具冲切等等传统方法，是提高质量与精密度、降低成本的本质解决方案，更是绿色低碳型制造、轻柔便捷式生产、数字化加工的必由之路。
• Area: PCB
• Booth No:
B238
• Website: http://www.dct-china.cn
• Brands: 德中（天津）技术发展股份有限公司
Exhibit Products
FPC激光精密钻孔设备
陶瓷基板激光精密切割设备
独立智能定位激光分板切割设备
双平台激光精密切割设备
小型激光精密切割设备
LTCC/HTCC激光精密钻孔设备
激光精密模板加工设备
常规幅面激光修复PCB设备
标准版水导激光精密切割设备
轨道式激光打标机
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