DUPONT TAIWAN LIMITED

DUPONT TAIWAN LIMITED

High-performing materials and advanced chemistry to flex, rigid-flex, rigid PCB, and IC substrate configurations for higher performance and efficiency. Advanced circuit metallization and imaging materials for fine line trend • A new generation pulse electroplating for advanced MLB • High reliability solution for multi-stack micro-via HDI application • A new generation via filling technology for fine line HDI application • Advanced dry film photoresist for fine line HDI Low-loss and signal integrity solutions for higher frequency and higher speed signal-transmission applications • An ideal Flexible Printed Circuit (FPC) laminate solution for high-reliability applications. • A thin buried capacitance laminate designed to function as a power and ground plane in high-speed signal transmission PCB. • A thermally conductive insulted metal PCB substrate system used for heat dissipation in electronics circuit boards.