Login
Contact
Share :
Description
Scope :
1. Flat the aperture-filled resin
2. Remove coarse copper particles after electroplating
3. Super-fine circuit grinding (25um)
4. Super-thin board grinding (0.084mm)
Features :
1. Formed structure, less chip problem
2. Uniform structure, long operation lifetime
3. Good grinding durability to promote PCB yield rate
1. Flat the aperture-filled resin
2. Remove coarse copper particles after electroplating
3. Super-fine circuit grinding (25um)
4. Super-thin board grinding (0.084mm)
Features :
1. Formed structure, less chip problem
2. Uniform structure, long operation lifetime
3. Good grinding durability to promote PCB yield rate
Related Products
Multi-Point Compensating X-Ray 2-Spindle Drilling Machine
Multiple circle measuring machine
FULLY AUTOMATIC CUTTING LINE
Automatic packaging and sorting machine
Automatic film tearing machine
Automatic pre-stacked line
Highest Rated Products
Edit Moisture Humility Indicator Color Change Blue Pink Card
Moisture Proof Packaging Bag for Electronic Products
Moisture Proof Customized Bag for Packing Video Card
Six Dots Humidity Indicator Card Blue to Pink
Multi-Point Compensating X-Ray 2-Spindle Drilling Machine
ATD300CV-S
AUTOTUBE
BEATRUM
AXELIA
Glad Fixed Achieve Valve
RT-1000 Rotary Tubing Dispenser
Pneumatic operated grease pump
Pneumatic operated grease pump
EP02 Powered Grease Lubricator
HP150 Pneumatic Valve
防焊塞孔万用导气板
防焊塞孔万用导气板
MD-2000N Micro Control Dispenser
Vacuum Area Gripping Systems : FQE
Electric Vacuum Generator : ECBPMi
Electrical Compact Pump : GCPi
Compact Valves : LQEc / LQEi
Compact Ejectors : SCPLb / SCPLc
KARDEX COMPACT BUFFER
KARDEX MEGAMAT
MACHINERY : KARDEX SHUTTLE
KARDEX HORIZONTAL CAROUSEL
Edge Clamped Thermal Curing Furnace
Fully Automatic Three-in-one machine Screen Printing Line
Double-Row Page-Turning Thermal Curing Furnace
Back
Product Inquiry