Acid copper electrolyte

HIGH DEPOSITION SPEED / HIGH CURRENT REVERSE PULSE PLATING TECHNOLOGY
It is crucial to select the correct electrolyte additive system in higher layer counts for the PCB process, especially for the server and communications market.

BENEFITS:
Efficient production: supporting high ASD production and outstanding TP performance to increase production efficiency.
Uniform distribution: minimum copper THK deviation for each TH design on PCB and eliminates uneven THK effect inside TH.
Able to control minimum copper requirement: Elevating product yield rate, cost and quality

Application:
- High layer count PCB
- Communication server

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