An electroplating copper solution for increasingly challenging substrate process In response to the increasingly challenging via-filling requirements in substrate manufacturing, SLOTOCOUP SF 70 offers strong support. Able to deal with stack layer or deep BMV design, or various depths of via-filling designs, its excellent filling capabilities and low copper thickness coverage help to achieve superior process quality. The strong filling capability can handle BMV & X-via designs of various depths, ensuring uniform copper thickness distribution.
Application: - Mega scale unit IC substrate - RF IC substrate