Japan Hakuto - Fully Automated Lamination Machine (Packaging Substrate) Mach510
Model: Mach510
Category: HDI, IC Carrier Board, Soft/Hard Combination Board
Exhibitor:
WORLD WIDE PCB EQUIPMENTS CO., LTD.
Booth No: B341
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Description
‧ Fully enclosed body design, equipped with FFU high-efficiency filtration. ‧ 3-point transmission with a lifting centering base plate. ‧ Specially designed lamination roller for uniform temperature and pressure. ‧ High film positioning accuracy and operational stability. ‧ Suitable for high-end substrate lamination including glass packaging substrate.