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Japan Hakuto - Fully Automated Lamination Machine (Packaging Substrate) Mach510

Model: Mach510

Category: HDI, IC Carrier Board, Soft/Hard Combination Board

Exhibitor: WORLD WIDE PCB EQUIPMENTS CO., LTD.

Booth No: B341

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Description
‧ Fully enclosed body design, equipped with FFU high-efficiency filtration.
‧ 3-point transmission with a lifting centering base plate.
‧ Specially designed lamination roller for uniform temperature and pressure.
‧ High film positioning accuracy and operational stability.
‧ Suitable for high-end substrate lamination including glass packaging substrate.

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