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Description
ENEPIG is formed by the deposition of electroless nickel, followed by electroless palladium, with an immersion gold flash. It is suitable for soldering, gold wire bonding, aluminum wire bonding, and contact resistance.
Related Products
Basic chemicals
Defoamer 70C
GT-01
Process IGEPIG - Immersion Gold / Electroless Palladium / Immersion Gold
Process ENIG - Electroless Nickel Immersion Gold
Wastewater Treatment
Copper Ball 25, 28, 55 mm. / Tin ball 22, 25 mm. / Copper Slug
PATA Chemicals services
Machine for plating (VCP Line) / PM Man Application
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