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VCP copper plating equipment

Model: K type 510

Category: Electroplating

Exhibitor: DONGWEI TECHNOLOGY (THAILAND) CO., LTD.

Booth No: B328

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Description
Panel plating& pattern plating, FPC via filling
Speed is 0.3~2m/min, adjustable;
Board size: fixed height 250mm, and length is 180-510mm;
Board thickness: 0.036~1.6mm;
density: max=5ASD
Uniformity: panel thickness R value ≦2.0μm(panel plating thickness is 10μm);
TP Value: 120-150%
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Alkaline etching liquid extraction, acidic etching liquid copper recovery.

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