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小型激光精密切割设备

Model: DirectLaser SA1

Category: Other

Exhibitor: DCT CO., LTD.

Booth No: B238

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Description
无应力:

专用载具配合激光加工,即使元器件距离切割道非常紧密,也无应力影响

热影响精确控制:

根据不同的热影响要求,选择适合的激光器种类,配合适合的激光加工参数,最大限度降低热影响

清洁加工:

加工过程中实时进行激光烟尘处理,最大限度降低烟尘对电路元件的影响

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