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Description
DirectLaser SA3采用双平台设计，充分节省了设备上下料的时间，使激光器始终保持在加工状态。设备适合裸板（PCB/FPC）和成品电路板（PCBA）各类加工任务，作为激光加工多面手，除满足PCBA分板及FPC覆盖膜开窗、外型切割、定深加工等切割应用，还可胜任简单钻孔加工。品种变换频率越高、电路板形状越复杂、孔越密越小，激光加工的优势就越突出，商业机会就越多
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