Printoganth U Plus

Printoganth U Plus provides excellent copper to copper interconnections even under
severe thermal shock conditions and meets highest reliability requirements from
leading automotive and smartphone OEMs.

Features and benefits
‧ Deposition rate: 0.35 – 0.4 μm in 4 min
‧ Cu to Cu interconnection with outstanding reliability
‧ Fulfils highest OEM reliability requirements such as
‧ 30 cycles IR reflow
‧ 1.000 cycles TCT and 2.000 cycles IST
‧ Fully analyzable stabilizer system
‧ Unparalleled capture pad adhesion for stacked via applications
‧ Mass production proven and qualified at major automotive & smartphone OEMs

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