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Description
1. Wide production operating window, enabling stable nickel plating with P content ranging from 8-11%
2. Low solution attack on solder mask
3. Ni bath: 3.5-4MTO for selective (4.5MTO for general); Au bath: 20 MTO for selective, (30MTO for general); less waste discharge
4. Dense and uniform nickel layer with minimal corrosion
5. Excellent resistance to skip plating or bleeding plating , capable of 35μm pitch
2. Low solution attack on solder mask
3. Ni bath: 3.5-4MTO for selective (4.5MTO for general); Au bath: 20 MTO for selective, (30MTO for general); less waste discharge
4. Dense and uniform nickel layer with minimal corrosion
5. Excellent resistance to skip plating or bleeding plating , capable of 35μm pitch
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