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Description
The Ledia 6FX delivers a sophisticated balance of fast cycle times and high precision while maintaining high definition with a high-resolution exposure engine and a high-power, three-wavelength LED light source.
It offers an ideal range of features for module and FC-CSP solder mask exposure, and it boasts imaging positional precision of 6um.
Further, high-speed scanning alignment ensures sophisticated overlay accuracy without sacrificing productivity.
Design Matching, a new function, lets operators add points without adding new alignment marks by allowing alignment templates to be extracted from user-specified figures.
Resolution: L/S = 12/12um
Min. SRO size: Dia. 40um
Imaging positional precision: 6um
It offers an ideal range of features for module and FC-CSP solder mask exposure, and it boasts imaging positional precision of 6um.
Further, high-speed scanning alignment ensures sophisticated overlay accuracy without sacrificing productivity.
Design Matching, a new function, lets operators add points without adding new alignment marks by allowing alignment templates to be extracted from user-specified figures.
Resolution: L/S = 12/12um
Min. SRO size: Dia. 40um
Imaging positional precision: 6um
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