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產品特色
Scope :
1. Flat the aperture-filled resin
2. Remove coarse copper particles after electroplating
3. Super-fine circuit grinding (25um)
4. Super-thin board grinding (0.084mm)
Features :
1. Formed structure, less chip problem
2. Uniform structure, long operation lifetime
3. Good grinding durability to promote PCB yield rate
1. Flat the aperture-filled resin
2. Remove coarse copper particles after electroplating
3. Super-fine circuit grinding (25um)
4. Super-thin board grinding (0.084mm)
Features :
1. Formed structure, less chip problem
2. Uniform structure, long operation lifetime
3. Good grinding durability to promote PCB yield rate
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