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產品特色
-Unique Plasma Technology integrated with Inductively Coupling Plasma (ICP) and Hollow Cathode Plasma (HCP) design.
-ICP & HCP are generated at the same time and it can substantially increase the plasma density as well as the process speed.
-By employing water-cooling electrodes, the resistance of the electrode surface can remain the same, increasing the process stability. Multiple Processing Gas Selectivity. Multiple Easy-Maintenance and Low-Maintenance-Cost Designs.
-High Automation and Operator Friendly Design.
-The machine can be produced in customized designs depending on the customer's requirements.
-Stepwise processing is available.
-Convenient Cart/Rack Loading/Unloading Designs.
-ICP & HCP are generated at the same time and it can substantially increase the plasma density as well as the process speed.
-By employing water-cooling electrodes, the resistance of the electrode surface can remain the same, increasing the process stability. Multiple Processing Gas Selectivity. Multiple Easy-Maintenance and Low-Maintenance-Cost Designs.
-High Automation and Operator Friendly Design.
-The machine can be produced in customized designs depending on the customer's requirements.
-Stepwise processing is available.
-Convenient Cart/Rack Loading/Unloading Designs.
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