登入
聯絡我們
分享 :
產品特色
Uyemura Japan has conducted extensive R&D on the IGEPIG process, focusing on wire bonding (WBR), solder joint reliability (SJR), fine pattern reliability, and electrical loss. Each characteristic has been evaluated to determine the optimum thickness for each IGEPIG layer.
PATA Chemicals supplies Uyemura chemical solutions used in the IGEPIG process, supporting stable and consistent performance in advanced PCB and packaging applications.
PATA Chemicals supplies Uyemura chemical solutions used in the IGEPIG process, supporting stable and consistent performance in advanced PCB and packaging applications.
相關產品
Analytical Instruments
Laboratory Service
Technical Service
Metal and Metal Salt
Chemicals Production Factory
Wastewater Treatment
Basic Chemicals
Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG)
Electroless Nickel Immersion Gold (ENIG)
您可能也感興趣
Stannatech LINE
SUS630 Pressed Steel Plate
Inpulse 2HF9
Stannopure PF 10
Sodium Persulfate (SPS)
BondFilm EX S-2
Printoganth U Plus
Potassium Persulfate (KPS)
Ammonium Persulfate
Conductive Electroless Plating Catalytic Ink
Top cover/Load-bearing board
OS-Tech SIT 2
Aurotech G-Bond 3
Printing Squeegee
MSA TIN ELECTRO PLATING
人氣產品專區
Import customs declaration
加热贴膜辊
液体清洁辊
涂布辊
AMA-X Series High-Head High-Flow Magnetic Drive Pump
AMF Series High-Head High-Flow Permanent Magnet Energy-Saving Pump
AMA Series High-Head High-Flow Magnetic Drive Pump
Fastener
Connectors
Electronic parts
Precision gears and medical supplies
Bobbins
Junction boxes and connectors
ROOTS BLOWER
SCREW BLOWER
DIFFUSERS
MAGNETIC DRIVE PUMP
TURBO BLOWER
Gas spring
disc spring
Die spring
Plastic Keyboard Series
Industrial Panel-PC（PPC）Series
Foil Keyboard Series
Industrial Touch Monitor Series
Glass Keyboard Series
Silicone Keyboard Series
Stainless Steel Keyboard Series
Glass Fiber Board
Halogen-Free Glass Fiber Board
回上頁
立即詢問