C Type Shuttle Table Low Pressure Molding Machine_C型雙滑模低壓成型機

Low pressure molding (LPM) is an advanced injection molding process using hot melt polyamide material to encapsulate electronic components at very low pressures (20–500 psi), ensuring gentle protection for sensitive PCBs and solder joints. Compared to conventional potting, LPM provides faster cycle times and cleaner, more efficient production while delivering excellent waterproof, dustproof, and moisture-resistant performance. KING’s Solution’s LPM machine features a C-type tie-bar-less design that offers a larger and more open working space, allowing long cables, wires, and connectors to be processed without obstruction. This makes the system especially suitable for PCB overmolding, waterproof cable overmolding, and electronic component encapsulation. For more information: https://kingsmachinery.com.tw/en/product/C-Type-Shuttle-Table-Low-Pressure-Molding-Machine.html

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