JIANGSU YSPHOTECH INTEGRATED CIRCUIT EQUIPMENT CO.,LTD.

JIANGSU YSPHOTECH INTEGRATED CIRCUIT EQUIPMENT CO.,LTD.

1.MT6-W:Solder Mask DI :Full-Collor Inks &White Ink Application Field:S/M exposure for HDI,Multilayer,Fast-sampling,etc; Key technical indicators： Throughput：360sides/hr@500mj; Min SRO：100um; Min solder DAM：50um; Alignment：±12um; Max substrate size：630mm*730mm; 2.RS20:High Resolution LDI Series Application Field : HDI ,Multilayer Applicable Process : Inner & Outer layers , D/F & W/F Key technical indicators: Throughput:300sides/hr@20mj/cm2; Resolution:15um/15um; Outer Layer Alignmen:±10um; Layer Alignment :20um; Max Panel size: 630mm*730mm; 3.RS30:High capacity LDI Series Application Field : MiniLED ,Multilayer Applicable Process : Inner & Outer layers , D/F & W/F Key technical indicators: Throughput:390sides/hr@20mj/cm2; Resolution:30um/30um; Outer Layer Alignmen:±12um; Layer Alignment :24um; Max Panel size: 630mm*730mm;