MSA TIN ELECTRO PLATING

SLOTOTIN SAT 20 has been well-established in the market for many years and iswidely trusted by customers. It holds a leading position in the organic acid tin market. Its unique grain structure and excellent protective capabilities provide advantages in the HLC PCB process, of HLC PCB, effectively preventing the electroplated copper inside the TH from being attacked by etching solutions.
The fine tin structure provides uniform protection for the underlying electroplated copper, even at lower tin thickness, from high to low ASD areas to ensure good protection for hull area.
SLOTOTIN SAT 20 effectively protects the electroplated copper within through-holes (TH) with the deposited tin layer. It is suitable for HLC PCBs and prevents etching solutions from attacking the copper layer.
SLOTOTIN SAT 20 Strong market share in organic acid base plating technology. Carbon footprint for minimal vs. maximal chemistry consumption. Fine crystal structure - fine and uniform tin grain structure.