BondFilm EX S-2

BondFilm EX S-2

Advanced adhesion enhancement promoter, engineered specifically for next-generation PCB designs. It provides a superior bonding interface while preserving copper integrity—an essential factor for high-frequency performance.

As high-frequency PCB applications continue to push the limits of signal performance and thermal reliability, traditional bonding enhancement processes are reaching their limits. To meet the demands of advanced RF and high-speed digital applications, manufacturers require an adhesion promoter that can deliver robust performance without compromising signal integrity.

Unlike conventional oxide and oxide alternative processes that rely on deeper copper etching to achieve adhesion, BondFilm EX-S2 delivers excellent adhesion with minimal copper removal. This results in a significantly smoother copper surface, which helps reduce conductor loss and improves signal transmission—key for applications in 5G, automotive radar, and high-speed computing.

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