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產品特色
High Resolution LDI Series ;
Application Field : IC SubstrateSLP,etc
Multilayer Applicable Process : Inner & Outer layers ,
D/F & W/F Key technical indicators: Throughput:90sides/hr@40mj/cm2;
Resolution:6um/6um;
Outer Layer Alignmen:±4um; Layer Alignment :8um; Max Panel size: 530mm*630mm;
Application Field : IC SubstrateSLP,etc
Multilayer Applicable Process : Inner & Outer layers ,
D/F & W/F Key technical indicators: Throughput:90sides/hr@40mj/cm2;
Resolution:6um/6um;
Outer Layer Alignmen:±4um; Layer Alignment :8um; Max Panel size: 530mm*630mm;
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RS30
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