Solder Mask DI :Full-Collor Inks &White Ink Application Field:S/M exposure for HDI,Multilayer,Fast-sampling,etc; Key technical indicators: Throughput:360sides/hr@500mj; Min SRO:100um; Min solder DAM:50um; Alignment:±12um; Max substrate size:630mm*730mm;
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IC Substrate LDI:CD Series
RS30
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