Aurotech G-Bond 3

Aurotech G-Bond 3 is the latest generation gold electrolyte that fulfills all industry standards for ENIG, ENEPIG, and EPAG plating. It exhibits autocatalytic plating properties to mitigate the attack to the underlying layer and enables the plating of high gold thickness where required.

Besides offering the highest bath stability and excellent layer performance, the process exhibits the benefit of non-toxic stabilization so that no handling of KCN replenishment is required. The new process combines the known benefits of Aurotech G-Bond 2 with outstanding stability, long bath life, and a new and toxic-free stabilizer.

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