vPlate

vPlate was developed to outperform existing plating lines available in
the market today. Our new plating tool does that already by providing uniformities of ± 7% and touch-free thin panel transportation down to
36 μm + 2 × 2 μm Cu clad. It achieves this by utilizing insoluble anodes with adjustable anode and cathode shielding. In addition, the tool fulfills technology roadmaps for next-generation HDI and package substrates down to L/S 8/8.
Full automation of the line, incl. automatic copper replenishment, and automatic panel size adaption, are standard features in vPlate.
An automatic grease supply and an automatic jig monitoring system provide options to improve operation comfort.
The possibility to design the line layout in one or more process track and with each track up to 14 plating cells, allows an adaption according to throughput and customer space availability.

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