BondFilm HF 1000 vs

For high frequency applications there is a demand for a bonding enhancement process that
gives the same excellent thermal reliability of the BondFilm product range, but with superior
performance in terms of reduced signal loss compared with the standard solutions available.
BondFilm HF1000 VS is a cost effective drop in replacement for conventional bonding
enhancement solutions. This new process can offer enhanced performance for high frequency
PCB manufacturing.

Features and benefits
‧ Simple drop in replacement for existing bonding enhancement equipment
‧ Greatly reduced signal loss fulfills signal integrity requirements
‧ Competitive process costs with current bonding enhancement systems
‧ Highly compatible with a wide range of high performance dielectric materials

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