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Description
PATA Chemicals supply high-quality chemical solutions for the ENEPIG (Electroless Nickel / Electroless Palladium / Immersion Gold) process, widely used in advanced PCB and IC package applications.
ENEPIG consists of electroless nickel and palladium layers with an immersion gold finish, offering excellent solderability, gold and aluminum wire bonding capability, and low contact resistance. It delivers superior solder joint reliability with lead-free SAC alloys, outstanding thermal stability, and resistance to black pad.
With no requirement for bussing lines, ENEPIG provides greater design flexibility and enables high-density circuit designs, while offering significant cost advantages compared to traditional electrolytic gold processes.
ENEPIG consists of electroless nickel and palladium layers with an immersion gold finish, offering excellent solderability, gold and aluminum wire bonding capability, and low contact resistance. It delivers superior solder joint reliability with lead-free SAC alloys, outstanding thermal stability, and resistance to black pad.
With no requirement for bussing lines, ENEPIG provides greater design flexibility and enables high-density circuit designs, while offering significant cost advantages compared to traditional electrolytic gold processes.
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Immersion Gold / Electroless Palladium / Immersion Gold (IGEPIG)
Electroless Nickel Immersion Gold (ENIG)
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