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Description
Uyemura Japan has conducted extensive R&D on the IGEPIG process, focusing on wire bonding (WBR), solder joint reliability (SJR), fine pattern reliability, and electrical loss. Each characteristic has been evaluated to determine the optimum thickness for each IGEPIG layer.
PATA Chemicals supplies Uyemura chemical solutions used in the IGEPIG process, supporting stable and consistent performance in advanced PCB and packaging applications.
PATA Chemicals supplies Uyemura chemical solutions used in the IGEPIG process, supporting stable and consistent performance in advanced PCB and packaging applications.
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