ENEPIG is formed by the deposition of electroless nickel, followed by electroless palladium, with an immersion gold flash. It is suitable for soldering, gold wire bonding, aluminum wire bonding, and contact resistance.
相關產品
PATA Chemicals services
Copper Ball 25, 28, 55 mm. / Tin ball 22, 25 mm. / Copper Slug
Basic chemicals
Wastewater Treatment
Machine for plating (VCP Line) / PM Man Application