Direct Imaging System - Ledia 8F

This high-precision model is the ideal solution for the HDI substrate which requires precise position accuracy in mSAP process, a module manufactured by mSAP/SAP process and package boards etc.
The new "Constant Calibration System" is integrated with the idea of maximizing the performance of the system which allows each head's position correction and calibration processing for the next upcoming boards in the meanwhile the operator is exchanging the previous boards.
The system is also highly versatile to meet market requirements, such as FC-BGA and substrates requiring high-precision imaging quality.

Minimum feature size (L/S): 12/12um
Minimum SRO size: Dia. 40um
Position accuracy: 5um

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