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產品特色
The Ledia 6S, a general-purpose model, offers a broad range of capability for solder mask and circuit pattern formation on multilayer boards, flexible boards, and HDIs. It is also available in a large, 32-inch variant, and it delivers stable exposure quality in a wide range of applications, including super-multilayer boards and rigid-flex boards.
Resolution: L/S = 30/30um
Min. SRO size: Dia. 60um
Imaging positional precision: 9um
Resolution: L/S = 30/30um
Min. SRO size: Dia. 60um
Imaging positional precision: 9um
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disc spring
Die spring
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