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Description
Hybrid Pattern AOI (2D + 3D)
2D Pattern Inspection
Resolution : 8 μm (Down To 2 μm)
Min. Line / Space Width : 40 μm (@8 μm)
16K Color Line Scan Camera / 4CH Color LED Illumination
AI Friendly Color Defect Image
Various Detection Algorithm (DRC, MDRC, MRC, SMI)
3D Metrology
White Light Interferometry
Z-Resolution : 50 nm
Measurement Repeatability
TOP : ±1.0 μm
BTM : ±1.5 μm
Measurement
Pattern Width / Pattern Thickness
Dimple Depth / Pad Diameter
Etc.
2D Pattern Inspection
Resolution : 8 μm (Down To 2 μm)
Min. Line / Space Width : 40 μm (@8 μm)
16K Color Line Scan Camera / 4CH Color LED Illumination
AI Friendly Color Defect Image
Various Detection Algorithm (DRC, MDRC, MRC, SMI)
3D Metrology
White Light Interferometry
Z-Resolution : 50 nm
Measurement Repeatability
TOP : ±1.0 μm
BTM : ±1.5 μm
Measurement
Pattern Width / Pattern Thickness
Dimple Depth / Pad Diameter
Etc.
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Direct Imaging System - Ledia Qs
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