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Description
-High-density plasma can be induced by employing MF power and unique ICP (Inductively Coupling Plasma) plasma design.
-Water-cooling Electrode design can remain the consistency of electrodes resistances and thus increases the process stability.
-Multiple gas selectivity or Mixing gases can be used.
-Single Chamber or Dual Chamber with In-line Automation Design.
-One Panel will be treated in each chamber. The cleaning/etching effect and uniformity will be much increased.
-Water-cooling Electrode design can remain the consistency of electrodes resistances and thus increases the process stability.
-Multiple gas selectivity or Mixing gases can be used.
-Single Chamber or Dual Chamber with In-line Automation Design.
-One Panel will be treated in each chamber. The cleaning/etching effect and uniformity will be much increased.
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