Vertical Plasma Desmear Machine

-Special implovements for electrodes, materials and flow patterns and thus increases 2~3 times etching rate.
-Unique Plasma Technology integrated with Inductively Coupling Plasma (ICP) and Hollow Cathode Plasma (HCP) design.
-ICP & HCP are generated at the same time, and it can substantially increase the plasma density as well as the process speed.
-By employing water-cooling electrodes, the resistance of electrode surface can remain the same and thus increases the process stability. Multiple Processing Gas Selectivity. Mutiple Easy-Maintain and Low-Maintenance-Cost Designs.
-High Automation and Operator Friendly Design.
-Dependant on the customer's requirements, the machine can be produced at some customized designs.
-Stepwise processing is available.
-Convenient Cart/Rack Loading/Unloading Improvements for electrodes, materials, and flow patterns and thus increase the 2~3 times

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