Exhibitor:
NANO ELECTRONICS AND MICRO SYSTEM TECHNOLOGIES, INC.
Booth No: G126
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Description
-Special implovements for electrodes, materials and flow patterns and thus increases 2~3 times etching rate. -Unique Plasma Technology integrated with Inductively Coupling Plasma (ICP) and Hollow Cathode Plasma (HCP) design. -ICP & HCP are generated at the same time, and it can substantially increase the plasma density as well as the process speed. -By employing water-cooling electrodes, the resistance of electrode surface can remain the same and thus increases the process stability. Multiple Processing Gas Selectivity. Mutiple Easy-Maintain and Low-Maintenance-Cost Designs. -High Automation and Operator Friendly Design. -Dependant on the customer's requirements, the machine can be produced at some customized designs. -Stepwise processing is available. -Convenient Cart/Rack Loading/Unloading Improvements for electrodes, materials, and flow patterns and thus increase the 2~3 times
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NANO ELECTRONICS AND MICRO SYSTEM TECHNOLOGIES, INC. - Vertical Plasma Desmear Machine
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