Exhibitor:
NANO ELECTRONICS AND MICRO SYSTEM TECHNOLOGIES, INC.
Booth No: G126
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Description
-Unique Plasma Technology integrated with Inductively Coupling Plasma (ICP) and Hollow Cathode Plasma (HCP) design. -ICP & HCP are generated at the same time and it can substantially increase the plasma density as well as the process speed. -By employing water-cooling electrodes, the resistance of the electrode surface can remain the same, increasing the process stability. Multiple Processing Gas Selectivity. Multiple Easy-Maintenance and Low-Maintenance-Cost Designs. -High Automation and Operator Friendly Design. -The machine can be produced in customized designs depending on the customer's requirements. -Stepwise processing is available. -Convenient Cart/Rack Loading/Unloading Designs.
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NANO ELECTRONICS AND MICRO SYSTEM TECHNOLOGIES, INC. - Horizontal Plasma Desmear Machine
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