Direct Imaging System - Ledia 7F

The Ledia 7F, our flagship model, features a high-performance exposure engine that delivers the resolution and resolution reproducibility required for circuit formation and solder mask rendering on semiconductor package boards.
The high-power, three-wavelength LED light source used across the entire Ledia series realizes optimal exposure characteristics by freely controlling single-, two-, and three-wavelength exposure.
The system boasts imaging positional precision of 6um, while high-speed scanning alignment ensures sophisticated overlay accuracy without sacrificing productivity.

Resolution: L/S = 10/10um
Min. SRO size: Dia. 30um
Imaging positional precision: 6um

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