Acid copper electrolyte

An electroplating copper solution for increasingly challenging substrate process
In response to the increasingly challenging via-filling requirements in substrate manufacturing, SLOTOCOUP SF 70 offers strong support.
Able to deal with stack layer or deep BMV design, or various depths of via-filling designs, its excellent filling capabilities and low copper thickness coverage help to achieve superior process quality.
The strong filling capability can handle BMV & X-via designs of various depths, ensuring uniform copper thickness distribution.

Application:
- Mega scale unit IC substrate
- RF IC substrate

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