New-generation high uniformity BMV filling technology for advance substate application. SLOTOCOUP SF 80 BMV filling technology provides exceptional copper plating distribution and low flat-ratio trace shape. This enhances performance to meet the requirements of advanced substrate manufacturing.
Benefits: - Outstanding plating copper distribution - Low profile trace shape Application: - Mega scale unit IC substrate - Hyper computing IC substrate
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Acid copper electrolyte
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Acid copper electrolyte
ENIG
MSA Tin Electro Plating
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30-31%HCL
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