MSA Tin Electro Plating

STORNG MARKET SHARE OF ORGANIC ACID BASE TIN PLATING TECH
Matt Tin SAT 20-1 has been well-established in the market for many years and is widely trusted by customers. It holds a leading position in the organic acid it market. Its unique grain structures and excellent protective capabilities provide advantages to the HLC PCB process, effectively preventing the electroplated copper inside the TH from being attacked by etching solution.
The fine and uniform Tin grain structure provides protection for electroplated copper beneath, even at lower tin thickness, from high to low ASD areas to ensure good protection for the hull area.
Matt Tin SAT 20-1 effectively protects the electroplated copper within TH under the tin plating layer which is suitable for HCL PCB, preventing etching solutions attack from the copper layer.
Fine crystal structure- fine and uniform tin grain structure can provide outstanding protection in every current density area after multi-dryfilm removal process

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